Posted May 14, 2009
Dave Danovitch (senior engineer at IBM’s Bromont facility) reprised his presentation on advanced packaging solutions at the spring Strategic Microelectronics Council’s Best Practice Forum in Ottawa on May 12. Sinjin Dixon-Warren, Manager process analysis at Chipworks, provided a user perspective on solutions like flip-chip packaging and system-on-a-chip. The session was hosted by Synopsys.