Posted April 1, 2009
Nearly 30 representatives of Montreal’s microelectronics community turned out to hear Dave Danovitch’s presentation on advanced packaging solutions at the latest Strategic Microelectronics Council’s Best Practice Forum. The forum, hosted by Wavesat, provided a highly interactive look at the challenges and benefits of solutions like flip-chip packaging and system-on-a-chip. The feedback from the session was overwhelmingly positive. Those who could not attend may want to take advantage of an encore performance Dave (who is a senior engineer at IBM’s Bromont facility) has planned for Ottawa on May 12.